Protection tape for printed circuit board and display device including the same

ABSTRACT

A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

CROSS-REFERENCE TO RELATED APPLICATION

This is a continuation application based on currently pending U.S.patent application Ser. No. 15/278,168, filed on Sep. 28, 2016, thedisclosure of which is incorporated herein by reference in its entirety.U.S. patent application Ser. No. 15/278,168 claims priority benefit ofKorean Patent Application No. 10-2016-0047562, filed on Apr. 19, 2016 inthe Korean Intellectual Property Office, the disclosure of which isincorporated herein by reference in its entirety for all purposes.

BACKGROUND 1. Field

One or more embodiments relate to a protection tape for a printedcircuit board (PCB).

2. Description of the Related Art

A display device generally includes a display panel and a PCBelectrically connected to the display panel. Wirings that transfer anelectrical signal to be applied to the display panel are formed in thePCB.

The display device may include a frame, various electronic devices suchas battery, etc., in addition to the display panel and the PCBelectrically connected to the display panel.

SUMMARY

Embodiments are directed to a protection tape for a printed circuitboard (PCB) including an insulating base plate, a conductive layer overthe insulating base plate, and an adhesive layer over the conductivelayer, the adhesive layer including a main part having a first thicknessand a subsidiary part having a second thickness less than the firstthickness, the main part corresponding to at least a center portion ofthe insulating base plate and the subsidiary part being arranged at anoutside of the main part.

The subsidiary part may be positioned outside the main part and maysurround the main part.

The subsidiary part may include a first subsidiary part positioned atone side of the main part and a second subsidiary part positioned atanother side of the main part, the first subsidiary part and the secondsubsidiary part being spaced apart from the main part.

The main part may include a groove in an upper surface of the main part,the groove extending in a direction between the second subsidiary partand the first subsidiary part, or the main part may include an openingin the upper surface of the main part in an upper surface of the mainpart, the opening extending in the direction between the secondsubsidiary part and the first subsidiary part in an upper surface of themain part.

The groove or opening may extend from an end of the main part next tothe first subsidiary part to an end of the main part next to the secondsubsidiary part.

The main part may include a groove extending in a direction from thefirst subsidiary part to the second subsidiary part in an upper surfaceof the main part. A height from an upper surface of the conductive layerin a direction toward the adhesive layer to a lower surface in thegroove may be less than a height from the upper surface of theconductive layer to an upper surface of the first subsidiary part.

An edge end surface of the insulating base plate may be flush with anedge end surface of the conductive layer. The subsidiary part may belocated over the conductive layer such that an upper surface of theconductive layer around at least one edge of the conductive layer isexposed.

The main part of the adhesive layer may include a plurality of groovesextending from an end of the main part adjacent to the first subsidiarypart to an opposite end of the main part adjacent to the secondsubsidiary part, the grooves being configured such that when theadhesive layer is pressed to the PCB in an attachment direction from thefirst subsidiary part toward the second subsidiary part, air that ispresent between the protection tape and the PCB is discharged to anoutside through the grooves and through a space between the main partand the second subsidiary part.

An edge end surface of the insulating base plate may be flush with anedge end surface of the conductive layer, The subsidiary part may belocated over the conductive layer such that an upper surface of theconductive layer around at least one edge of the conductive layer isexposed.

The conductive layer may be positioned over the insulating base plate soas to expose an upper surface of the insulating base plate around atleast one edge of the insulating base plate.

The conductive layer may include a center part having a third thickness,and an edge part having a fourth thickness greater than the thirdthickness, the center part of the conductive layer corresponding to themain part of the adhesive layer and the edge part corresponding to thesubsidiary part of the adhesive layer.

A distance from an upper surface of the insulating base plate to anupper surface of the main part of the adhesive layer may be the same asa distance from the upper surface of the insulating base plate to anupper surface of the subsidiary part of the adhesive layer.

An upper surface of a portion of the conductive layer corresponding tothe subsidiary part may include a plurality of grooves. The subsidiarypart may fill the plurality of grooves.

The main part and the subsidiary part may be spaced apart from eachother.

The subsidiary part may include a conductive material.

A modulus of the subsidiary part may be greater than a modulus of themain part.

Each of the main part and the subsidiary part may include oligomers andmonomers. A ratio of the monomers to oligomers in the subsidiary partmay be higher than a ratio of the monomers to oligomers in the mainpart.

Embodiments are also directed to a display device including a displaypanel, a printed circuit board (PCB) electrically connected to thedisplay panel, and the protection tape for the PCB as described abovecovering one surface of the PCB.

The display panel may include an upper surface and a lower surface. ThePCB may include an upper surface and a lower surface. The display panelor the PCB may be bent such that the lower surface of the display paneland the lower surface of the PCB face each other. The protection tapefor the PCB may cover the upper surface of the PCB.

A main part and a subsidiary part of the adhesive layer may be spacedapart from each other.

The subsidiary part of the adhesive layer may include a conductivematerial. The PCB may include a ground part electrically connected tothe subsidiary part.

A modulus of the subsidiary part may be greater than a modulus of themain part.

Each of a main part and a subsidiary part of the adhesive layer mayinclude oligomers and monomers. A ratio of the a ratio of the monomersto oligomers in the subsidiary part may be higher than a ratio of themonomers to oligomers in the main part.

Embodiments are also directed to a display device including a displaypanel, a printed circuit board (PCB) electrically connected to thedisplay panel, and a protection tape for a PCB covering one surface ofthe PCB. The protection tape for the PCB may include an insulating baseplate, a conductive layer over the insulating base plate, and anadhesive layer over the conductive layer, the adhesive layer beingdirectly attached to the PCB such that an interface between the adhesivelayer and the PCB is essentially free of air bubbles.

The adhesive layer may include a main part corresponding to at least acenter portion of the insulating base plate and a subsidiary part spacedapart from the main part to correspond to at least one edge of theinsulating base plate, the subsidiary part having a thickness less thana thickness of the center portion of the main part.

The adhesive layer may not extend beyond a boundary of the PCB.

The display device further may include at least one electronic deviceattached to an opposite surface of the protection tape from the PCB.

The at least one electronic device may include a battery or a camera.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of skill in the art by describingin detail exemplary embodiments with reference to the attached drawingsin which:

FIG. 1 illustrates a schematic perspective view of a protection tape fora printed circuit board (PCB), according to an embodiment;

FIG. 2 illustrates a schematic lateral view of a display deviceincluding the protection tape for the PCB of FIG. 1, according to anembodiment;

FIG. 3 illustrates a schematic lateral view of a display device,according to an embodiment;

FIG. 4 illustrates a schematic cross-sectional view of a part of adisplay device, according to an embodiment;

FIG. 5 illustrates a schematic perspective view of a protection tape fora PCB, according to an embodiment;

FIG. 6 illustrates a schematic cross-sectional view of a part of adisplay device, according to an embodiment;

FIG. 7 illustrates a schematic perspective view of a protection tape fora PCB, according to an embodiment;

FIG. 8 illustrates a schematic perspective view of a protection tape fora PCB, according to an embodiment;

FIG. 9 illustrates a schematic perspective view of a protection tape fora PCB, according to an embodiment;

FIG. 10 illustrates a schematic perspective view of a protection tapefor a PCB, according to an embodiment;

FIG. 11 illustrates a schematic perspective view of a protection tapefor a PCB, according to an embodiment;

FIG. 12 illustrates a schematic perspective view of a protection tapefor a PCB, according to an embodiment;

FIG. 13 illustrates a schematic perspective view of a protection tapefor a PCB, according to an embodiment;

FIG. 14 illustrates a schematic perspective view of a protection tapefor a PCB, according to an embodiment;

FIG. 15 illustrates a schematic perspective view of a protection tapefor a PCB, according to an embodiment;

FIG. 16 illustrates a schematic perspective view of a protection tapefor a PCB, according to an embodiment;

FIG. 17 illustrates a schematic perspective view of a protection tapefor a PCB, according to an embodiment; and

FIG. 18 illustrates a schematic lateral view of a display device,according to an embodiment.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art.

In the drawing figures, the dimensions of layers and regions may beexaggerated for clarity of illustration. It will also be understood thatwhen a layer or element is referred to as being “on” another layer orsubstrate, it can be directly on the other layer or substrate, orintervening layers may also be present. Like reference numerals refer tolike elements throughout.

In the following examples, the x-axis, the y-axis and the z-axis are notlimited to three axes of the rectangular coordinate system, and may beinterpreted in a broader sense. For example, the x-axis, the y-axis, andthe z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another.

FIG. 1 illustrates a schematic perspective view of a protection tape 100for a printed circuit board (PCB), according to an embodiment. As shownin FIG. 1, the protection tape 100 may include a base plate 110, aconductive layer 120, and an adhesive layer 130.

The base plate 110 may define an overall shape of the protection tape100. The base plate 110 may include an insulating material such as, forexample, polyethylene terephthalate (PET), polyimide (PI), etc.

The conductive layer 120 may be positioned on an upper surface of thebase plate 110 (+z direction). The conductive layer 120 may include aconductive material such as copper, and, as shown in FIG. 1, may coveran entire surface of the base plate 110.

The adhesive layer 130 may be positioned over the conductive layer 120and may include a main part 135 and a subsidiary part 133. The main part135 may correspond to at least a center portion of the base plate 110.The subsidiary part 133 may be positioned outside the main part 135. Forexample, in FIG. 1, the subsidiary part 133 includes a first subsidiarypart 131 positioned at one side of the main part 135 (−x direction) anda second subsidiary part 132 positioned at another side of the main part135 (+x direction) and spaced apart from the first subsidiary part 131.A second thickness t2 that is a thickness of the subsidiary part 133 maybe smaller than a first thickness t1 that is a thickness of the mainpart 135. The adhesive layer 130 may an adhesive layer material such as,for example, a pressure sensitive adhesive (PSA).

The protection tape 100 for the PCB according to the present embodimentmay be a component of a display device as shown in FIG. 2. FIG. 2illustrates a schematic lateral view of the display device, according toan embodiment. When the display device includes a display panel 200 anda PCB 300 electrically connected to the display panel 200, theprotection tape 100 as shown in FIG. 1 may cover one surface of the PCB300 as a component of the display device.

The display panel 200 may have an upper surface and a lower surface. ThePCB 300 also may have an upper surface and a lower surface. As shown inFIG. 2, the PCB 300 may be bent such that the lower surface of thedisplay panel 200 and the lower surface of the PCB 300 face each other.Herein, the term “upper surface” is used refer to an outward-facingsurface of the PCB 300. Accordingly, when the PCB 300 is bent such thatthe lower surface of the display panel 200 and the lower surface of thePCB 300 face each other inwardly, the outward-facing surface willcontinue to be referred to as the upper surface, even though it may facedownward as illustrated in FIG. 2. The protection tape 100 may cover theupper surface of the PCB 300. As illustrated in FIG. 2, the protectiontape 100 may cover only a part of the upper surface of the PCB 300. Insome implementations, the protection tape 100 may entirely cover theupper surface of the PCB 300.

FIG. 3 illustrates a schematic lateral view of a display deviceaccording to another embodiment. As illustrated in FIG. 3, the PCB 300may not be bent but instead, a part of the display panel 200 may bebent. In this case, a substrate included in the display panel 200 mayinclude various materials having a flexible or bendable characteristic,for example, a polymer resin such as polyethersulfone (PES),polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate(PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS),polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetatepropionate (CAP).

When the display panel 200 is bent, the lower surface of the PCB 300 mayface the lower surface of the display panel 200. In this case, theprotection tape 100 for the PCB may cover the entire upper surface ofthe PCB 300. Although the protection tape 100 covers an entire surfaceof the upper surface of the PCB 300 as shown in FIG. 3, or, in someimplementations, may cover only a part of the upper surface of the PCB300.

As shown in FIGS. 2 and 3, the display device may include variouscomponents in addition to the display panel 200, the PCB 300, and theprotection tape 100. For example, the display device may include aframe, and/or various electronic devices such as a battery BT, a cameramodule CM, etc. In the display device, it is desirable that the displaysurface of the display panel 200 be visible to a user. Thus variouselectronic devices and the frame may be positioned at the rear side ofthe display panel 200 (−z direction), for example, in the rear side ofthe display panel 200 and the PCB 300 (−z direction).

In a general display device, there is a possibility that wirings formedin a PCB could contact other electronic devices and/or a frame, etc.during a manufacturing process or while the display device is in useafter the display device is completely manufactured. Such contact couldcause conductive wirings formed in the PCB to become electricallyconnected to such other electronic devices unexpectedly or could cause ashort circuit to occur between the conductive wirings formed in the PCBdue and such other electronic devices or a frame, etc.

However, in the display device according to the present embodiment, theprotection tape 100 covers the upper surface of the PCB 300.Accordingly, conductive wirings of the PCB 300 may be covered by theprotection tape 100, thereby effectively preventing the conductivewirings from contacting various electronic devices such as the batteryBT, the camera module CM, etc and the frame that are positioned in therear side of the display panel 200 and the PCB 300 (−z direction)Adefect may be prevented from occurring in a manufacturing process orwhile in use after the display device is completely manufactured. Inaddition, when the protection tape 100 includes the conductive layer120, the conductive layer 120 may act as a shield layer that prevents awiring over the PCB 300 from being affected by external electromagneticwaves.

As described above, the second thickness t2, which is a thickness of thesubsidiary part 133 of the adhesive layer 130, may be less than thefirst thickness t1, which is a thickness of the main part 135 thereof.The main part 135 may correspond to at least a center portion of thebase plate 110. The subsidiary part 133 may be positioned outside themain part 135. Thus, the first thickness t1, which is a thickness of thecenter portion of the adhesive layer 130, may be understood as beinggreater than the second thickness t2, that is a thickness at one edge ofthe protection tape 100.

The protection tape 100 may be attached to the PCB 300 as shown in FIGS.2 and 3. If the adhesive layer 300 included in the protection tape 100were to have a uniform thickness in a entire area of the conductivelayer 120, the adhesive layer 130 might not be present only between theprotection tape 100 and the PCB 300, but a portion of the adhesive layer130 could move outside an area of the PCB 300 during a process ofattaching the protection tape 100 to the PCB 300. If a portion of theadhesive layer 130 were to move outside of the area of the PCB 300, theportion of the adhesive layer 130 could become unintentionally adheredto an electronic device that is another component of the display device.Accordingly, a malfunction of the other electronic device, etc. couldoccur. For example, if at least a part of the adhesive layer 130 hasconductivity, the conductive part of the adhesive layer 130 could moveoutside the area of the PCB 300 and could adhere to the other electronicdevice, which could cause a defect such as a short circuit, etc.

However, in the display device according to the present embodiment, thesecond thickness t2, which is a thickness of the subsidiary part 133 ofthe adhesive layer 130, may be less than the first thickness t1, whichis a thickness of the main part 135 of the protection layer 100. Themain part 135 may correspond in location and area to at least a centerportion of the base plate 110. The subsidiary part 133 may be positionedoutside of the main part 135. The thickness of the adhesive layer 130 isrelated to an amount of adhesive layer material positioned over theconductive layer 120 per unit area of the conductive layer 120. It maybe understood that as the thickness of the adhesive layer 130 isreduced, the amount of the adhesive layer material positioned over theconductive layer 120 per unit area of the conductive layer 120 is alsoreduced. Therefore, in the protection tape 100 included in the displaydevice according to the present embodiment, the adhesive layer 130 mayhave a greater thickness at an approximate center portion of theconductive layer 120 and a smaller thickness at an approximate edgethereof. It may be understood that an amount of the adhesive layermaterial per unit area may be smaller at the approximate edge of theconductive layer 120 than at the approximate center portion thereof inrelation to the conductive layer 120. Accordingly, the display deviceaccording to the present embodiment may dramatically reduce apossibility of a defect being caused due to portion of the adhesivelayer 130 moving outside the area of PCB 300 during the process ofattaching the protection tape 100 to the PCB 300.

As shown in FIG. 1, the subsidiary part 133 having the second thicknesst2 less than the first thickness t1 of the main part 135 may include thefirst subsidiary part 131 positioned in one side of the main part 135(−x direction) and the second subsidiary part 132 positioned in anotherside of the main part 135 (+x direction). The adhesive layer 130 mayhave a lesser thickness around a first edge of the conductive layer 120extending from the −x direction to a y axis direction and a second edgethereof extending from the +x direction to the y axis direction. In someimplementations, the adhesive layer 130 may have a greater thickness forthe most part around a third edge of the conductive layer 120 extendingfrom the +y direction to an x axis direction and a fourth edge thereofextending from the −y direction to the x axis direction in FIG. 1according to a direction in which the protection tape 100 is attached tothe PCB 300.

When the protection tape 100 is attached to the PCB 300, all parts ofthe facing surface of the protection tape 100 may not be attached to thefacing surface of the PCB 300 at exactly the same time. For example, avicinity of an edge of the protection tape 100 that is an −x axisdirection edge extending in the y axis direction, i.e., the edge of thefirst subsidiary part 131 of the adhesive layer 130 and/or a vicinitythereof, may contact a corresponding part of the PCB 300 first. An areaof the adhesive layer 130 contacting the PCB 300 may gradually increase,and a vicinity of an edge of the adhesive layer 130 that is a +x axisdirection edge extending in the y axis direction, i.e., the edge of thesecond subsidiary part 132 of the adhesive layer 130, may then contact acorresponding part of the PCB 300.

During the process of attaching the protection tape 100 to the PCB 300as described above, the base plate 110 of the protection tape 100 may bepressed. Pressing the protection tape 100 may start from the firstsubsidiary part 131 of the adhesive layer 130 and may progress towardthe second subsidiary part 132 via the main part 135. In this regard, apossibility that the adhesive layer 130 moves outside the area of thePCB 300 may relatively increase in a first pressing part and a finalpressing part during the process of attaching the protection tape 100 tothe PCB 300. However, when the adhesive layer 130 has the firstsubsidiary part 131 and the second subsidiary part 132, which have alesser thicknesses in the first pressing part and the final pressingpart, movement of the adhesive layer 130 outside of the area of the PCB300 during the process of attaching the protection tape 100 to the PCB300 may be effectively hindered or prevented. The display deviceaccording to the present embodiment may also ensure secure attachmentbetween the protection tape 100 and the PCB 300 through the main part135, which has a greater thickness than the first subsidiary part 131and the second subsidiary part 132. In some implementations, thesubsidiary part 133 may surround the main part 135.

Although the adhesive layer 130 remains in a state as shown in FIG. 1before attaching the protection tape 100 to the PCB 300, the adhesivelayer 130 may have a different shape from that shown in FIG. 1 whenpressure is applied to the protection tape 100 and/or the PCB 300, forexample, when the protection tape 100 is attached to the PCB 300. Theadhesive layer 130 may have elasticity, for example, while theprotection tape 100 is attached to the PCB 300. Accordingly, thethickness of the adhesive layer 130 may be approximately uniform in mostareas of the protection tape 100. In this case, amount of internalstress in the main part 135 of the adhesive layer 130 may be greaterthan the amount of internal stress in the subsidiary part 133 thereofdue to an amount of the adhesive layer material per unit area beinggreater in the main part 135 than in the subsidiary part 133 in relationto the conductive layer 120.

As described above, the display device according to an embodiment mayinclude the display panel 200, the PCB 300 electrically connected to thedisplay panel 200, and the protection tape 100 covering one surface ofthe PCB 300. The protection tape 100 may include the insulating baseplate 110, the conductive layer 120 located over the base plate 110, andthe adhesive layer 130 located over the conductive layer 120. Aninternal stress at a center portion of the base plate 110 may be thaninternal stress at an edge of the base plate 110.

Even if the adhesive layer 130 continuously contacts the PCB 300 due toa deformed shape of the adhesive layer 130, the thickness of theadhesive layer 130 may vary according to a position of the adhesivelayer 130. For example, a thickness of the center portion of the mainpart 135 of the adhesive layer 130 may be greater than the thickness ofthe subsidiary part 133 thereof. FIG. 4 illustrates a schematiccross-sectional view of a part of a display device, according to anotherembodiment. As shown in FIG. 4, the display device may include theprotection tape 100 The protection tape 100 continuously contacts theconductive layer 120 and the adhesive layer 130 having a thicknessgreater in a center portion of the base plate 110 than in one edge ofthe base plate 110.

A modulus of the subsidiary part 133 may be higher than the modulus ofthe main part 135 in order to prevent a part of the first subsidiarypart 131 or the second subsidiary part 132 of the adhesive layer 130from moving outside the area of the PCB 300 during a process ofattaching the protection tape 100 to the PCB 300. A relatively highmodulus may refer to a relative greater hardness. As a result, when theprotection tape 100 is attached to the PCB 300, it may be possible tominimize or prevent the subsidiary part 133 having a high modulus frombeing moved outside the area of the PCB 300.

Various techniques may be used to adjust modulus. For example, if amaterial including oligomers and monomers is used to form the adhesivelayer 130, the modulus may be adjusted by adjusting a ratio of monomersto oligomers. If the ratio of monomers to oligomers increases in amixture of oligomers and monomers, the average chain length of amaterial of the adhesive layer 130 becomes shorter, and the modulus mayincrease. If the ratio of monomers to oligomers is reduced in themixture of oligomers and monomers, the average chain length of thematerial of the adhesive layer 130 becomes longer, the modulus may bereduced. Thus, each of the main part 135 and the subsidiary part 133 ofthe protection tape 100 may include oligomers and monomers, and a ratioof monomers to oligomers in the main part 135 may be higher than a ratioof monomers to oligomers in the subsidiary part 133. Thus, the modulusof the subsidiary part 133 may be higher than the modulus of the mainpart 135.

The protection tape 100 for the PCB and the display device including theprotection tape 100 are described above. The present disclosure is notlimited to only the protection tape 100 for the PCB or the displaydevice including the protection tape 100 for the PCB. Both theprotection tape 100 for the PCB and the display device including theprotection tape 100 belong to the scope of the disclosure. This mayapply to embodiments that will be described later and modificationsthereof. Embodiments regarding the protection tape 100 for the PCB willbe described below for convenience of description.

As shown in FIG. 1, the main part 135 and the subsidiary part 133 of theadhesive layer 130 may be integrally formed. FIG. 5 illustrates aschematic perspective view of the protection tape 100 for the PCBaccording to another embodiment. As shown in FIG. 5, the main part 135and the subsidiary part 133 of the adhesive layer 130 may be spacedapart from each other.

A shape of the adhesive layer 130 may be deformed if pressure is appliedto the protection tape 100 and/or the PCB 300 when the protection tape100 is attached to the PCB 300, as described above. When the adhesivelayer 130 includes the subsidiary part 133 having the lesser secondthickness t2 and the main part 135 having the greater first thicknesst1, as described above, an amount of the adhesive layer material perunit area may be greater in the main part 135 than in the subsidiarypart 133 in relation to the conductive layer 120. An empty space may beobtained by spacing the main part 135 and the subsidiary part 133 apartfrom each other. Accordingly, movement of adhesive layer material fromthe main part 135 to outside the are of the PCB 300 may be hindered orprevented. Instead, such adhesive layer material may move into the emptyspace between the main part 135 and the subsidiary part 133 even if ashape of the main part 135 of the adhesive layer becomes deformed whenthe protection tape 100 is attached to the PCB 300.

Although the adhesive layer 130 remains in a state as shown in FIG. 5before attaching the protection tape 100 to the PCB 300, the adhesivelayer 130 may have a different shape from that shown in FIG. 5 ifpressure is applied to the protection tape 100 and/or the PCB 300 whenthe protection tape 100 is attached to the PCB 300. In particular, anamount of internal stress in the main part 135 of the adhesive layer 130may be greater than an amount of internal stress in the subsidiary part133 thereof, due to an amount of the adhesive layer material per unitarea being greater in the main part 135 than in the subsidiary part 133in relation to the conductive layer 120.

As described above, the display device according to an embodiment mayinclude the display panel 200, the PCB 300 electrically connected to thedisplay panel 200, and the protection tape 100 for the PCB covering onesurface of the PCB 300. The protection tape 100 for the PCB may includethe insulating base plate 110, the conductive layer 120 arranged overthe base plate 110, and the adhesive layer 130 arranged over theconductive layer 120. The adhesive layer 130 may include the main part135 corresponding to at least a center portion of the base plate 110 andthe subsidiary part 133 spaced apart from the main part 135 tocorrespond to at least one edge of the base plate 110 and having lessinternal stress than the main part 135.

Even if the protection tape 100 is attached to the PCB 300 due to adeformed shape of the adhesive layer 130, a thickness of the adhesivelayer 130 may be different according to a position of the adhesive layer130. For example, a thickness of a center portion of the main part 135of the adhesive layer 130 may be greater than the thickness of thesubsidiary part 133 thereof. FIG. 6 illustrates a schematiccross-sectional view of a part of a display device, according to anotherembodiment. As shown in FIG. 6, the adhesive layer 130 of the protectiontape 100 for the PCB may include the main part 135 corresponding to atleast a center portion of the base plate 110 and the subsidiary part 133spaced apart from the main part 135 to correspond to at least one edgeof the base plate 110 and having a thickness smaller than the thicknessof the center portion of the main part 135.

As shown in FIG. 5, the first subsidiary part 131 may be positioned atone side of the main part 135 (−x direction) and the second subsidiarypart 132 may be positioned at another side of the main part 135 (+xdirection). FIG. 7 illustrates a schematic perspective view of theprotection tape 100 for the PCB according to another embodiment.According to FIG. 7, the subsidiary part 133 may surround the main part135.

FIG. 8 illustrates a schematic perspective view of the protection tape100 for the PCB, according to another embodiment. In the protection tape100 according to the present embodiment, the main part 135 of theadhesive layer 130 may include a groove 135 a extending in a directionbetween the first subsidiary part 131 and the second subsidiary part 132in an upper surface (+z direction) of the main part 135. As shown inFIG. 8, the groove 135 a may extend from an end of the main part 135 ina direction toward the first subsidiary part 131 to an end of the mainpart 135 in a direction toward the second subsidiary part 132. Thegroove 135 a may be connected to a space between the main part 135 andthe first subsidiary part 131 and to space between the main part 135 andthe second subsidiary part 132. When the protection tape 100 is attachedto the PCB 300, it is desirable to prevent air, etc. from being trappedbetween the protection tape 100 and the PCB 300. The groove 135 a mayact to prevent or reduce the likelihood of air being trapped.

As described above, when the protection tape 100 is attached to the PCB300, a vicinity of an edge of the protection tape 100 that is a −x axisdirection edge extending in a y axis direction, i.e., the firstsubsidiary part 131 of the adhesive layer 130 and/or a vicinity thereof,may contact a corresponding part of the PCB 300 first, and an area ofthe adhesive layer 130 that contacts the PCB 300 may gradually increaseuntil a vicinity of an edge of the adhesive layer 130 that is a +x axisdirection edge extending in they axis direction, i.e., the secondsubsidiary part 132 of the adhesive layer 130, contacts a correspondingpart of the PCB 300. Air between the protection tape 100 and the PCB 300may be discharged to the outside through the groove 135 a. Thus, theprotection tape 100 according to the present embodiment may effectivelyprevent air from being trapped between the protection tape 100 and thePCB 300.

The groove 135 a may extend in a direction from the first subsidiarypart 131 to the second subsidiary part 132. Accordingly, the groove 135a may allow air to naturally move and to be finally discharged outsideduring a process of attaching the protection tape 100 to the PCB 300sequentially from the first subsidiary part 131 to the second subsidiarypart 132 via the main part 135. The groove 135 a may be connected to thespace between the main part 135 and the first subsidiary part 131 and tothe space between the main part 135 and the second subsidiary part 132such that the groove 135 a and the spaces may act as a path throughwhich air is discharged to the outside.

Various methods may be used to form the groove 135 a. For example, amold having a protrusion corresponding to a shape of the groove 135 amay be pressed into the main part 135 having a planar upper surface suchthat the main part 135 a includes the groove 135 a in the upper surface.When the protection tape 100 including the groove 135 a is attached tothe PCB 300, the shape of the adhesive layer 130 having elasticity maybecome deformed. Accordingly, the groove 135 a may be sunken. In thiscase, when the shape of the main part 135 of the adhesive layer 130 isdeformed, the adhesive layer 130 may continuously contact the PCB 300.

A height from an upper surface of the conductive layer 120 (+zdirection) to a lower surface of the groove 135 a may be greater thanthe height from the upper surface of the conductive layer 120 to anupper surface of the first subsidiary part 131 or the second subsidiarypart 132. Thus, during the process of attaching the protection tape 100to the PCB 300, the groove 135 a may be connected to the space betweenthe main part 135 and the first subsidiary part 131 and the spacebetween the main part 135 and the second subsidiary part 132 such thatthe groove 135 a and the spaces may act as the path through which air isdischarged to the outside. If the height from the upper surface of theconductive layer 120 (+z direction) to the lower surface of the groove135 a were to be less than the height from the upper surface of theconductive layer 120 to the upper surface of the first subsidiary part131 or the second subsidiary part 132, the groove 135 a may not besufficiently deep and may be very shallow. In this case, when the shapeof the adhesive layer 130 having elasticity is deformed when theprotection tape 100 is attached to the PCB 300, the groove 135 a may besunken before air between the protection tape 100 and the PCB 300 isdischarged to the outside through the groove 135 a, and thus air may betrapped between the protection tape 100 and the PCB 300.

In FIG. 8, the main part 135 includes the groove 135 a. FIG. 9illustrates a schematic perspective view of the protection tape 100 forthe PCB, according to another embodiment. As shown in FIG. 9, groove 135a the main part 135 of the protection tape 100 may be deepened toconstitute an the opening 135 a extending in a direction from the firstsubsidiary part 131 to the second subsidiary part 132. A height of thegroove 135 a of FIG. 8 may be identical to the first thickness t1, whichis a thickness of the main part 135.

An edge end surface of the base plate 110, an edge end surface of theconductive layer 120, and an edge end surface of the adhesive layer 130are shown to be identical to each other in FIG. 1 FIG. 10 illustrates aschematic perspective view of the protection tape 100 for the PCB,according to another embodiment. For example, as shown in FIG. 10, anedge end surface 110 a of the base plate 110 and an edge end surface 120a of the conductive layer 120 may be identical to each other, and thesubsidiary part 133 may be positioned over the conductive layer 120 toexpose an upper surface 120 b of the conductive layer 120 around atleast one edge. Movement of the first subsidiary part 131 or the secondsubsidiary part 132 of the adhesive layer 130 to outside the area of thePCB 300 during a process of attaching the protection tape 100 to the PCB300 may be hindered or prevented.

FIG. 11 illustrates a schematic perspective view of the protection tape100, according to another embodiment. As shown in FIG. 11, the main part135 and the subsidiary part 133 of the adhesive layer 130 may also bespaced apart from each other. In addition, the main part 135 may includethe groove or opening 135 a in an upper surface of the main part 135, asshown in FIGS. 8 and 9.

FIG. 12 illustrates a schematic perspective view of the protection tape100 according to another embodiment. As shown in FIG. 12, end surfacesof the conductive layer 120 and the adhesive layer 130 may be identicalto or coextensive with each other. The conductive layer 120 may belocated over the base plate 110 such that the upper surface 110 b of thebase plate 110 is exposed around at least one edge. In someimplementations, the main part 135 and the subsidiary part 133 of theadhesive layer 130 may be spaced apart from each other as shown in FIGS.5, 8, 9, and 11.

FIG. 13 illustrates a schematic perspective view of the protection tape100 for the PCB, according to another embodiment. As shown in FIG. 13,the main part 135 and the subsidiary part 133 of the adhesive layer 130may be spaced apart from each other, and the main part 135 may includethe groove or opening 135 a in an upper surface.

FIG. 14 illustrates a schematic perspective view of the protection tape100 for the PCB, according to an embodiment. In the protection tape 100according to this embodiment, the conductive layer 120 may not have auniform thickness. For example, the conductive layer 120 may include acenter portion corresponding to the main part 135 of the adhesive layer130 and having a third thickness t3 and an edge part corresponding tothe subsidiary part 133 of the adhesive layer 130 and having a fourththickness t2 greater than the third thickness t3. In this case, when anupper surface of the adhesive layer 130 is planar when the adhesivelayer 130 is formed over the conductive layer 120, the subsidiary part133 may naturally have the second thickness t2 less than the firstthickness t1 of the main part 135. In this regard, a distance from anupper surface of the base plate 110 to an upper surface of the main part135 of the adhesive layer 130 may be understood as being the same as thedistance from the upper surface of the base plate 110 to an uppersurface of the subsidiary part 133.

FIG. 15 illustrates a schematic perspective view of the protection tape100 for the PCB, according to an embodiment that is further to astructure as shown in FIG. 14. As shown in FIG. 15 , the main part 135and the subsidiary part 133 of the adhesive layer 130 may be spacedapart from each other.

FIG. 16 illustrates a schematic perspective view of the protection tape100 for the PCB, according to an embodiment. As shown in FIG. 16, themain part 135 may include the groove or opening 135 a in an uppersurface (see FIG. 9), etc.

FIG. 17 illustrates a schematic perspective view of the protection tape100 for the PCB, according to an embodiment. The conductive layer 120 ofthe protection tape 100 according to this embodiment may include aplurality of grooves 120 c in an upper surface thereof at a locationcorresponding to the subsidiary part 133 of the adhesive layer 130.Adhesive layer material of the subsidiary part 133 of the adhesive layer130 may fill the grooves 120 c of the conductive layer 120.

When the adhesive layer material of the subsidiary part 133 of theadhesive layer 130 fills the grooves 120 c of the conductive layer 120,a bonding force between the subsidiary part 133 and the conductive layer120 may increase, thereby effectively preventing the subsidiary part 133of the adhesive layer 130 from moving outside the area of the PCB 300when the protection tape 100 is attached to the PCB 300. For example, asshown in FIG. 17, each of the grooves 120 c of the conductive layer 120may have a shape extending in a direction (y axis direction) crossing adirection (+x direction) from the first subsidiary part 131 to thesecond subsidiary part 132, thereby minimizing movement of thesubsidiary part 133 of the adhesive layer 130 in the direction (+xdirection) from the first subsidiary part 131 to the second subsidiarypart 132 or in a direction (−x direction) opposite to the direction (+xdirection) when the protection tape 100 is attached to the PCB 300.

In some implementations, the conductive layer 120 may not include thegrooves 120c, but an adhesive force of the subsidiary part 133 of theadhesive layer 130 may be greater than the adhesive force of the mainpart 135, thereby preventing the subsidiary part 133 of the adhesivelayer 130 from moving outside the area of the PCB 300 when theprotection tape 100 is attached to the PCB 300. Various methods may beused to adjust the adhesive force of the adhesive layer 130. Forexample, the adhesive force may increase as temperature increases.Accordingly, when the subsidiary part 133 is contacted with theconductive layer 120, a high temperature such as 100° C. may be appliedor maintained, and when the main part 135 is contacted with theconductive layer 120, a room temperature may be maintained, therebyadjusting the adhesive force of the different parts of the adhesivelayer 130 when the protection tape 100 is attached to the PCB 300.

In some implementations, the adhesive layer 130 may include a materialthat reacts with ultraviolet rays. Ultraviolet rays may be irradiatedonto a specific portion of the adhesive layer 130, and an adhesive forceof the portion on which ultraviolet rays are irradiated may be varied.For example, the adhesive force of the main part 135 may be made to beless than the adhesive force of the subsidiary part 133 by irradiatingultraviolet rays onto the main part 135 of the adhesive layer 130. Forreference, an adhesive force of a general PSA may be weakened whenultraviolet rays are irradiated.

FIG. 18 illustrates a schematic lateral view of a display device,according to another embodiment, In the embodiments of the protectiontape 100 described above and modifications thereof, the subsidiary part133 of the adhesive layer 130 may include a conductive material. In thiscase, when the adhesive layer 130 is positioned over the conductivelayer 120, the subsidiary part 133 of the adhesive layer 130 may beelectrically connected to the conductive layer 120. If the PCB 300includes a ground part 310 over a surface to which the protection tape100 for the PCB is attached, as shown in FIG. 18, and the ground part310 contacts the subsidiary part 133 of the adhesive layer 130 includedin the protection tape 100, the conductive layer 120 of the protectiontape 100 may be electrically connected to the ground part 310 of the PCB300 through the subsidiary part 133. In this case, the conductive layer120 of the protection tape 100 may be grounded, and thus the conductivelayer 120 may effectively act as a shield layer that protects a wiringor an electronic device, etc. over the PCB 300 from an externalelectrical signal, etc. As shown in FIG. 18, the PCB 300 may include theground part 310 in each of ends in −x and +x directions such that eachof the first subsidiary part 131 and the second subsidiary part 132 ofthe adhesive layer 130 of the protection tape 100 contacts the groundpart 310 of the PCB 300.

The embodiments described above and modifications thereof may becombined. For example, when the main part 135 and the subsidiary part133 of the adhesive layer 130 are spaced apart from each other as shownin FIG. 17, the conductive layer 120 may include the grooves 120 c in anupper surface of a portion corresponding to the subsidiary part 133, orwhen the main part 135 and the subsidiary part 133 of the adhesive layer130 are integrally formed as shown in FIG. 1, the conductive layer 120may include the grooves 120 c in the upper surface of the portioncorresponding to the subsidiary part 133.

As described above, according to the embodiments, a protection tape fora PCB capable of preventing a defect from occurring during amanufacturing process or while in use and a display device including thesame may be implemented.

By way of summation and review, in a conventional display device thereis a risk that wirings formed in a printed circuit board (PCB) maycontact other electronic devices and/or a frame, etc. during amanufacturing process or while in use after the display device iscompletely manufactured. Such contact could cause the conductive wiringsformed in the PCB to be electrically connected to other electronicdevices unexpectedly or could cause a short circuit between theconductive wirings formed in the PCB due to other electronic device or aframe, etc.

One or more embodiments include a protection tape for a PCB capable ofpreventing a defect from occurring during a manufacturing process or useof a display device. One or more embodiments are directed to a displaydevice including the protection tape.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope thereof as set forth in thefollowing claims.

What is claimed is:
 1. A protection tape for a printed circuit board(PCB), the protection tape comprising: an insulating base plate; aconductive layer over the insulating base plate; and an adhesive layerover the conductive layer, the adhesive layer including a main parthaving a first thickness and a subsidiary part having a second thicknessless than the first thickness, the main part corresponding to at least acenter portion of the insulating base plate and the subsidiary partbeing arranged at an outside of the main part, wherein: the subsidiarypart includes a first subsidiary part positioned at one side of the mainpart and a second subsidiary part positioned at another side of the mainpart, the first subsidiary part and the second subsidiary part beingspaced apart from the main part, and wherein: the main part includes agroove in an upper surface of the main part, the groove extending in adirection between the second subsidiary part and the first subsidiarypart, or the main part includes an opening in the upper surface of themain part, the opening extending in the direction between the secondsubsidiary part and the first subsidiary part in an upper surface of themain part.
 2. The protection tape for a PCB as claimed in claim 1,wherein the subsidiary part is positioned outside the main part andsurrounds the main part.
 3. The protection tape for a PCB as claimed inclaim 1, wherein the first subsidiary part and the second subsidiarypart of the adhesive layer are located adjacent to opposite ends of themain part of the adhesive layer.
 4. The protection tape for a PCB asclaimed in claim 1, wherein the groove or opening extends from an end ofthe main part next to the first subsidiary part to an end of the mainpart next to the second subsidiary part.
 5. A protection tape for aprinted circuit board (PCB), the protection tape comprising: aninsulating base plate; a conductive layer over the insulating baseplate; and an adhesive layer over the conductive layer, the adhesivelayer including a main part having a first thickness and a subsidiarypart having a second thickness less than the first thickness, the mainpart corresponding to at least a center portion of the insulating baseplate and the subsidiary part being arranged at an outside of the mainpart, wherein: the subsidiary part includes a first subsidiary partpositioned at one side of the main part and a second subsidiary partpositioned at another side of the main part, the first subsidiary partand the second subsidiary part being spaced apart from the main part,the main part includes a groove extending in a direction from the firstsubsidiary part to the second subsidiary part in an upper surface of themain part, and a height from an upper surface of the conductive layer ina direction toward the adhesive layer to a lower surface in the grooveis greater than a height from the upper surface of the conductive layerto an upper surface of the first subsidiary part.
 6. The protection tapefor a PCB as claimed in claim 3, wherein the main part of the adhesivelayer includes a plurality of grooves extending from an end of the mainpart adjacent to the first subsidiary part to an opposite end of themain part adjacent to the second subsidiary part.
 7. The protection tapefor a PCB as claimed in claim 1, wherein: an edge end surface of theinsulating base plate is flush with an edge end surface of theconductive layer, and the subsidiary part is located over the conductivelayer such that an upper surface of the conductive layer around at leastone edge of the conductive layer is exposed.
 8. The protection tape fora PCB as claimed in claim 1, wherein the conductive layer is positionedover the insulating base plate so as to expose an upper surface of theinsulating base plate around at least one edge of the insulating baseplate.
 9. A protection tape for a printed circuit board (PCB), theprotection tape comprising: an insulating base plate; a conductive layerover the insulating base plate; and an adhesive layer over theconductive layer, the adhesive layer including a main part having afirst thickness and a subsidiary part having a second thickness lessthan the first thickness, the main part corresponding to at least acenter portion of the insulating base plate and the subsidiary partbeing arranged at an outside of the main part, wherein the conductivelayer includes a center part having a third thickness, and an edge parthaving a fourth thickness greater than the third thickness, the centerpart of the conductive layer corresponding to the main part of theadhesive layer and the edge part corresponding to the subsidiary part ofthe adhesive layer.
 10. The protection tape for a PCB as claimed inclaim 9, wherein a distance from an upper surface of the insulating baseplate to an upper surface of the main part of the adhesive layer is thesame as a distance from the upper surface of the insulating base plateto an upper surface of the subsidiary part of the adhesive layer. 11.The protection tape for a PCB as claimed in claim 9, wherein thesubsidiary part includes a first subsidiary part positioned at one sideof the main part and a second subsidiary part positioned at another sideof the main part, the first subsidiary part and the second subsidiarypart being spaced apart from the main part, and wherein: the main partincludes a groove in an upper surface of the main part, the grooveextending in a direction between the second subsidiary part and thefirst subsidiary part, or the main part includes an opening in the uppersurface of the main part, the opening extending in the direction betweenthe second subsidiary part and the first subsidiary part in an uppersurface of the main part.
 12. A protection tape for a printed circuitboard (PCB), the protection tape comprising: an insulating base plate; aconductive layer over the insulating base plate; and an adhesive layerover the conductive layer, the adhesive layer including a main parthaving a first thickness and a subsidiary part having a second thicknessless than the first thickness, the main part corresponding to at least acenter portion of the insulating base plate and the subsidiary partbeing arranged at an outside of the main part, wherein: an upper surfaceof a portion of the conductive layer corresponding to the subsidiarypart includes a plurality of grooves, and the subsidiary part fills theplurality of grooves.
 13. The protection tape for a PCB as claimed inclaim 12, wherein the subsidiary part includes a first subsidiary partpositioned at one side of the main part and a second subsidiary partpositioned at another side of the main part, the first subsidiary partand the second subsidiary part being spaced apart from the main part,and wherein: the main part includes a groove in an upper surface of themain part, the groove extending in a direction between the secondsubsidiary part and the first subsidiary part, or the main part includesan opening in the upper surface of the main part, the opening extendingin the direction between the second subsidiary part and the firstsubsidiary part in an upper surface of the main part.
 14. The protectiontape for the PCB as claimed in claim 1, wherein the main part and thesubsidiary part are spaced apart from each other.
 15. The protectiontape for the PCB as claimed in claim 1, wherein the subsidiary partincludes a conductive material.
 16. The protection tape for the PCB asclaimed in claim 1, wherein a hardness of the subsidiary part is greaterthan a hardness of the main part.
 17. The protection tape for the PCB asclaimed in claim 1, wherein: each of the main part and the subsidiarypart includes oligomers and monomers, and a ratio of the monomers tooligomers in the subsidiary part is higher than a ratio of the monomersto oligomers in the main part.
 18. A display device, comprising: adisplay panel including an upper surface and a lower surface; a printedcircuit board (PCB) electrically connected to the display panel; and theprotection tape for the PCB as claimed in claim 1 covering one surfaceof the PCB.
 19. The display device as claimed in claim 18, wherein themain part and the subsidiary part of the adhesive layer are spaced apartfrom each other.
 20. The display device as claimed in claim 18, wherein:the subsidiary part of the adhesive layer includes a conductivematerial, and the PCB comprises a ground part electrically connected tothe subsidiary part.
 21. The display device as claimed in claim 18,wherein a hardness of the subsidiary part is greater than a hardness ofthe main part.
 22. The display device as claimed in claim 18, wherein:each of a main part and a subsidiary part of the adhesive layer includesoligomers and monomers, and a ratio of the monomers to oligomers in thesubsidiary part is higher than a ratio of the monomers to oligomers inthe main part.
 23. The display device as claimed in claim 18, whereinthe adhesive layer does not extend beyond a boundary of the PCB.
 24. Thedisplay device as claimed in claim 18, wherein the display devicefurther includes at least one electronic device attached to an oppositesurface of the protection tape from the PCB.
 25. The display device asclaimed in claim 24, wherein the at least one electronic device includesa battery or a camera.